Thermal Paste

SpecificationsMfr Part Number: MX-2 (30G)/ACTCP00003BDensity: 3.96 g/ cm3Viscosity: 850 poiseNet Weight: 30.0 gThermal Conductivity :5.6 W/(mK)Volume Resistivity : 1.22 x 1012 Ω-cmWarranty : 8 years

SpecificationsMfr Part Number: MX-4 4G ACTCP00002BFeatures:Optimised Packaging Saves ResourcesBetter than Liquid MetalEasy to ApplySafe ApplicationHigh DurabilityValue for MoneyThermal Conductivity: 8.5 W/mKViscosity: 870 poiseDensity: 2.5 g/cm3Volume...

SpecificationsMfr Part Number: ARCTIC MX-4/ORACO-MX40101-GBFeatures:Easy to applyOptimal thermal conductivityLow thermal resistanceElectrically non-conductiveNon-capacitiveNon-curingNon-corrosiveNon-bleedingThermal Conductivity: 8.5 W/mKViscosity: 870...

Specifications Mfr Part Number: AS5-12G Features: Contains 99.9% pure silver High-Density(contains over 88% thermally conductive filler by weight) Controlled Tripple-Phase Viscosity Not Electrically Conductive and Absolute Stability (will not...

Specifications Mfr Part Number: AS5-3.5G Features: Contains 99.9% pure silver, High-Density(contains over 88% thermally conductive filler by weight), Controlled Tripple-Phase Viscosity, Not Electrically Conductive and Absolute Stability (will not...

SpecificationMfr Part Number: CMQ2-25GFeatures:Tri-Linear Ceramic ContentPolysynthetic suspension fluidExcellent stabilityElectrical insulator2 °C lower CPU full load temperatures than standard thermal compound or thermal padsInnovative dispenserEasy to...

Specifications Mfr Part Number: CMQ-2.5G Model: Ceramique Weight: 2.5 grams Volume: 1cc tube (1 piece) High-Density ceramic content: Ceramique uses a high-density layered composite of five unique shapes of thermally conductive aluminum oxide, boron...

Specifications Mfr Part Number: CAN-60ML Features: Unique 2-Step Process ArctiClean 1 Thermal Material Cleaner ArctiClean 2 Thermal Surface Purifier Volume: 30ml Arcticlean 1 And 30ml Arcticlean 2 (Total 60ml) Package: Bulk

SpecificationsMfr Part Number: G15Features:Perfect for high performance CPU, GPU or other types of chipsetsthe nanotechnology material makes the thermal paste stable, non-volatile and smooth to applyEco-friendly, non-conductive, and strongly corrosion...

SpecificationsMfr Part Number: Z9Features:Excellent Thermal ConductivityElectrically non-conductiveWide range of application temperatureApplication: High quality thermal paste to provide excellent heat transfer from CPU/GPU to coolerThermal Conductivity:...